Gas cushion apparatus and techniques for substrate coating

ABSTRACT

A method of forming a material layer on a substrate comprises loading a substrate into a printing zone of a coating system using a substrate handler, printing an organic ink material on a substrate while the substrate is located in the printing zone, transferring the substrate from the printing zone to a treatment zone of the coating system, treating the organic ink material deposited on the substrate in the treatment zone to form a film layer on the substrate, and removing the substrate from the treatment zone using the substrate handler.

CLAIM OF PRIORITY

This patent application is a Continuation application of U.S. patentapplication Ser. No. 15/417,583, filed Jan. 27, 2017, currently pending,which is a Divisional application of U.S. patent application Ser. No.14/697,370, filed on Apr. 27, 2015, now U.S. Pat. No. 9,586,226. U.S.patent application Ser. No. 14/697,370 claims the benefit of priority ofeach of (1) U.S. Provisional Patent Application No. 61/986,868, filedApr. 30, 2014; and (2) U.S. Provisional Patent Application No.62/002,384, filed May 23, 2014. Each application identified in thissection is hereby incorporated herein by reference in its entirety.

BACKGROUND

Material layers can be formed on a substrate, such as to provide one ormore functional or non-functional layers of an electronic device. In oneapproach, film layers on such devices can be fabricated in part viavacuum deposition of a series of thin films onto the substrate using anyof a number of techniques, including without limitation, chemical vapordeposition, plasma enhanced chemical vapor deposition, sputtering,electronic beam evaporation, and thermal evaporation. However vacuumprocessing in this manner is relatively: (1) complex, generallyinvolving a large vacuum chamber and pumping subsystem to maintain suchvacuum; (2) wasteful of the raw material being deposited, because alarge fraction of the material in such a system is generally depositedonto the walls and fixtures of the interior of the deposition chamber,such that more material is generally wasted than deposited onto thesubstrate; and (3) difficult to maintain, such as involving frequentlystopping the operation of the vacuum deposition tool to open and cleanthe walls and fixtures of built-up waste material. In the case ofsubstrates larger in surface area than generally available siliconwafers, these issues present further challenges.

In certain applications, it can be desirable to deposit a film in aspecified pattern. In another approach, a blanket coating can bedeposited over the substrate and photolithography can be considered forachieving desired patterning. But, in various applications, suchphotolithography processes can damage existing deposited film layers. Aso-called shadowmask can be used to pattern a deposited layer directlywhen using a vacuum deposition technique. The shadowmask in such casescomprises a physical stencil with cut-outs for the deposition regionsthat can be, for example, manufactured out of a metal sheet. Theshadowmask is generally aligned to, and placed in proximity to or incontact with, the substrate prior to deposition, kept in place duringdeposition, and then removed after deposition.

Such direct-patterning via shadowmask adds substantial complexity tovacuum-based deposition techniques, generally involving additionalmechanisms and fixturing to handle and position the mask preciselyrelative to the substrate, further increasing the material waste (due tothe waste from material deposited onto the shadowmask), and furtherincreasing a need for maintenance to continuously clean and replace theshadowmasks. Such thin masks can be mechanically unstable over largeareas, limiting the maximum size of substrate that can be processed, andit is therefore the case that again, for substrates larger in surfacearea than generally available silicon wafers, these issues areespecially challenging.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates generally an example of a plan view of at least aportion of a coating system.

FIG. 2 illustrates generally an example of a plan view of at least aportion of a coating system, such as can include two or more printingzones and treatment zones.

FIGS. 3A through 3D illustrate generally further examples of plan viewsof at least a portion of a coating system.

FIG. 4A illustrates generally a technique, such as a method, that caninclude forming patterned solid layer on a substrate, such as caninclude using the systems shown in the examples of FIG. 1, 2, or 3Athrough 3D.

FIG. 4B illustrates generally a technique, such as a method, that caninclude forming an organic encapsulation layer (OEL), such as caninclude using the systems shown in the examples of FIG. 1, 2, or 3Athrough 3D.

FIG. 5 illustrates generally an example depicting various regions of asubstrate.

FIG. 6 illustrates generally a schematic representation of a gaspurification scheme that can be used in relation to portions orentireties of one or more other examples described herein, such as toestablish or maintain an controlled environment in an enclosure.

FIG. 7 illustrates generally an example of at least a portion of asystem for integrating and controlling one or more gas or air sources,such as to establish floatation control zones included as a portion of afloatation conveyance system.

FIG. 8A and FIG. 8B include illustrative examples of a chuckconfiguration that can establish a pressurized gas cushion to support asubstrate, such as during one or more of a deposition (e.g., printing),holding, or treatment process, and a corresponding uniformity in aresulting processed substrate in FIG. 8C.

FIG. 9 illustrates generally an example of a diagram illustrating atreatment system, such as can be configured to expose a substrate tolight (e.g., ultraviolet light), such as can be used in treating acoating on a substrate.

FIGS. 10A and 10B illustrate generally examples of at least a portion ofa treatment system that can include a linear configuration of lightsources, such as can be used in treating a coating on a substrate.

FIG. 11A and 11B illustrate generally views a portion of a system, suchas including a transfer module, that can be included as a portion of acoating system or can be used to manipulate a substrate before or afterprocessing by a coating system.

FIG. 12 illustrates generally a portion of a system such as including afurther example of a transfer module, that can be included as a portionof a coating system or can be used to manipulate a substrate before orafter processing by a coating system.

FIG. 13A and FIG. 13B illustrate generally views of a portion of asystem, such as can include a stacked configuration of substrateprocessing areas that can be used in processing a substrate.

DETAILED DESCRIPTION

Embodiments of an enclosed coating system according to the presentteachings can be useful for coating of substrates in the manufacture ofa variety of apparatuses and devices in a wide range of technologyareas, for example, but not limited by, organic light emitting diode(OLED) displays, OLED lighting, organic photovoltaics, Perovskite solarcells, printed circuit boards, and organic and inorganic semiconductordevices or circuits.

The present inventors have recognized, among other things, that a solidlayer can be formed on a substrate at an ambient pressure at or nearatmospheric pressure, such as using a printing technique to deposit aliquid ink over a specified region of the substrate, and treating theliquid ink to solidify the liquid ink to provide the solid layer,including supporting the substrate at least in part using a gas cushionduring such printing, and including continuing to the support thesubstrate at least in part using the gas cushion during the treatment ofthe liquid ink. The present inventors have also recognized, among otherthings, that in this manner a number of handling steps can be reduced,such as for one or more of reducing latency, reducing mechanical damageto the substrate during engagement, for example, by a handler, orenhancing uniformity of a solid layer provided by various embodiments ofa coating system of the present teachings. Various processes that can beperformed in embodiments of a coating system of the present teachingscan include holding the substrate for a specified duration after suchprinting and before treatment of the liquid ink, including continuing tosupport the substrate at least in part using the gas cushion duringvarious processes performed.

Broadly, the printing operation can include one or more liquid coatingprocesses, such as inkjet printing, nozzle printing, slot die coating(patterned or un-patterned), or screen printing, and the liquid ink cancomprise one or more of an organic material (e.g., a monomer or apolymer) or an inorganic material, and can include a carrier fluid.Treatment of the liquid ink can include one or more of light exposure(e.g., including one or more of ultraviolet, infra-red, or visiblelight), heating or cooling, higher-than-ambient pressure or vacuum. Suchtreatment can result in solidification of liquid ink to provide thesolid layer through one or more of removal of a carrier fluid (e.g., oneor more of drying or baking, such as including vacuum drying or vacuumbaking), chemical reaction (e.g., cross linking or chemicaltransformation from one compound to another), or densification (e.g.,baking, such as including vacuum baking). The printed layer can bepatterned or blanket coated over the substrate, and can coat or can beincluded as part of a light emitting device (e.g., a display or lightingpanel), a light absorbing device (e.g., photodetector or solar cell), aprinted circuit assembly, or other electronic device or circuit.

The present inventors have recognized, among other things, that printingtechniques and other processing operations can be carried out usingsystems having enclosures configured to provide a controlledenvironment, such as including an atmosphere comprising a gas that isminimally reactive or non-reactive with one or more species depositedupon or comprising a substrate being processed, such gas having aspecified purity level. Such a specified purity level can also includecontrolled maximum impurity concentrations of species reactive tovarious materials and components of devices manufactured usingembodiments of coating systems of the present teachings, such as, forexample, but not limited by oxygen, ozone, and water vapor, as well asvarious organic solvent vapors. Controlling various reactive species toa specified purity level can prevent degradation of materials anddevices being fabricated upon the substrate during fabrication, reduceor prevent the incorporation of impurities into the materials anddevices being fabricated upon the substrate during fabrication that maysubsequently cause, accelerate, or facilitate the degradation of suchmaterials or devices after fabrication, or to inhibit or suppressdefects. Particulate controls can also be provided, such as to maintaina specified particulate level within the controlled environment.

The arrangement of enclosures can include respective modules havingindividually-maintained controlled environments, or one or more of themodules can share a controlled environment with other modules.Facilities such as gas purification, temperature control, solventabatement, or particulate control can be shared between modules or canbe provided in a dedicated manner. Various examples of a gaspurification according to the present teachings can include maintaininglevels for various reactive species, including various reactiveatmospheric gases, such as water vapor, oxygen, ozone, as well asorganic solvent vapors at 1000 ppm or lower, for example, at 100 ppm orlower, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm or lower.

Various devices, such as electronic or optoelectronic devices, can befabricated using organic materials, including using processingtechniques to provide one or more film layers. Organic optoelectronicdevices can be volumetrically compact because of their relatively thinand planar structure, along with providing enhanced power efficiency andenhanced visual performance, such as compared to other displaytechnologies. Such devices can be mechanically flexible (e.g., foldableor bendable), or optically transparent, unlike competing technologies.Applications for an organic optoelectronic device can include generalillumination, use as a backlight illumination source, or use as a pixellight source or other element in an electroluminescent display, forexample. One class of organic optoelectronic devices includes organiclight emitting diode (OLED) devices, which can generate light usingelectroluminescent emissive organic materials such as small molecules,polymers, fluorescent, or phosphorescent materials, for example.

In an example, the printing operation can include inkjet printing aliquid ink comprising an organic material, and the treating the liquidink can include exposing the liquid ink to light, such as ultraviolet(UV) light, to cure the liquid ink to provide the solid layer. A curingprocess, such as including UV illumination, can induce a cross linkingreaction, thereby forming a patterned solid layer. For example, thepatterned solid layer can coat at least a portion of a light-emittingdevice or other device fabricated upon the substrate. The solid layercan encapsulate a specified region on the substrate, such as included ina stack of layers forming an encapsulating structure.

The systems and techniques described herein can be used in support ofprocessing a range of different substrate configurations. For example, aflat panel display device can be fabricated at least in part usingsystems or techniques described herein. Such a flat panel display devicecan include an organic light emitting diode (OLED) flat panel display.Several OLED flat panel displays can be processed on a substrate. Use ofthe word “substrate” or the phrase “substrate being fabricated” refersgenerally to an assembly in-process, such as can include an OLED device.The examples herein need not be restricted to a particular panelgeometry or size. For example, such systems and techniques can be usedin support of fabrication of display devices on substrates having ageneration 2 (“Gen 2”) size, such as having a rectangular geometryincluding dimensions of about 37 centimeters (cm) by about 47 cm. Thesystems described herein can also be used for somewhat larger substrategeometries, such as in support of fabrication of display devices onsubstrates having a generation 3.5 (“Gen 3.5”) substrate size, such ashaving a rectangular geometry including dimensions of about 61centimeters (cm) by about 72 cm. The systems described herein can alsobe used for even larger substrate geometries, such as in support offabrication of display devices on substrates having a substrate sizecorresponding to “Gen 5.5,” having dimensions of about 130 cm×150 cm, ora “Gen 7” or “Gen 7.5” substrate, having dimensions of about 195 cm×225cm. For example, a Gen 7 or Gen 7.5 substrate can be singulated (e.g.,cut or otherwise separated) into eight 42 inch (diagonal dimension) orsix 47 inch (diagonal dimension) flat panel displays. A “Gen 8”substrate can include dimensions of about 216×246 cm. A “Gen 8.5”substrate can include dimensions of about 220 cm×250 cm, and can besingulated to provide six 55 inch or eight 46 inch flat panels persubstrate.

Dimensions beyond Gen 8.5 can be supported using systems and techniquesdescribed herein. For example, a “Gen 10” substrate having dimensions ofabout 285 cm×305 cm, or beyond, can be fabricated at least in part usingsystems and techniques described herein. The panel sizes describedherein, while generally applicable to glass substrates, can applied tosubstrates of any material suitable for use in display devicefabrication, and in particular OLED display fabrication that can includeforming one or more layers using printing techniques. For example, avariety of glass substrate materials can be used, as well as a varietyof polymeric substrate materials, for example, polyimide.

FIG. 1 illustrates generally an example of a plan view of at least aportion of a coating system 2600. The system 2600 can be configured toprovide a solid layer in a specified region of a substrate, such as afirst side of a substrate facing upward. The solid layer can coat atleast a portion of the substrate, such as formed in a specified pattern.The system 2600 can include an arrangement of zones, such as eachconfigured to support the substrate at least in part using a gas cushionarrangement using pressurized gas provided to a second side of thesubstrate opposite the first side. For example, the solid layer can bepatterned or blanket coated over the substrate, and can coat or can beincluded as part of a light emitting device (e.g., a display or lightingpanel), a light absorbing device (e.g., photodetector or solar cell), aprinted circuit assembly, or other electronic device or circuit.

The coating system 2600 can include a printing system 2000, such as caninclude an inkjet printhead configured to deposit a liquid coating overthe specified region of the substrate (e.g., providing a blanket orpatterned liquid coating). For example, the printing system 2000 caninclude apparatus for reliable placement of ink drops onto specificlocations on a substrate. Such apparatus can include one or more of aprinthead assembly 2501, ink delivery system, substrate supportapparatus such as a platform (e.g., a floatation “table”) to provide thepressurized gas, loading and unloading apparatus, and facilities formanagement of the printhead.

In the illustrative example of FIG. 1, the printing system 2000 caninclude a bridge 2130, such as attached to risers. The bridge cansupport a first carriage assembly 2301 and a second carriage assembly2302, where such carriages are movable in at least one axis (e.g., an“X-axis”) along the bridge 2130. The first carriage assembly can controlmovement of the printhead assembly 2501 across the bridge 2130, such asusing a linear air bearing motion system, which can be intrinsicallylow-particle generating. In an example, one or more of the first orsecond carriage assemblies 2301 or 2302 can have a vertical (e.g.,“Z-axis”) moving plate mounted thereupon. In an example, the first andsecond carriage assemblies 2301 and 2302 can each carry a printheadassembly. In another example, such as shown in FIG. 1, the firstcarriage assembly 2301 can carry the printhead assembly 2501, and thesecond carriage assembly 2302 can carry one or more cameras, such as acamera 2303 for monitoring or inspection of a substrate coatingoperation.

Each printhead assembly, such as the printhead assembly 2501, can have aplurality of printheads mounted in at least one printhead device. Aprinthead device can include, for example, but not limited by, fluidicand electronic connections to at least one printhead; each printheadhaving a plurality of nozzles or orifices capable of ejecting ink at acontrolled rate, velocity and size. For example, the printhead assembly2501 can include between about 1 to about 60 printhead devices, whereeach printhead device can have between about 1 to about 30 printheads ineach printhead device. A printhead, for example, an industrial inkjethead, can have between about 16 to about 2048 nozzles, which can expel adroplet volume of between about 0.1 picoliters (pL) to about 200 pL,according to an illustrative example.

As mentioned above, the printing operation can include one or moreliquid coating processes, such as inkjet printing, nozzle printing, slotdie coating (patterned or un-patterned), or screen printing, and theliquid ink can comprise one or more of an organic material (e.g., amonomer or a polymer) or an inorganic material, and can include acarrier fluid. Treatment of the liquid ink can include one or more oflight exposure (e.g., including one or more of ultraviolet, infra-red,or visible light), heating or cooling, higher-than-ambient pressure orvacuum. Such treatment can result in solidification of liquid ink toprovide the solid layer through one or more of removal of a carrierfluid (e.g., one or more of drying or baking, such as including vacuumdrying or vacuum baking), chemical reaction (e.g., cross linking orchemical transformation from one compound to another), or densification(e.g., baking, such as including vacuum baking). In another approach, asolid-phase material can be vaporized thermally for deposition onto asubstrate through a jet. In yet another approach, material can bedissolved or otherwise suspended in a carrier liquid, and a layerincluding the material can be formed by dispensing a continuous streamon fluid from a nozzle onto a substrate to form a line (so-called“nozzle printing” or “nozzle jet”) and subsequent evaporation of thecarrier to provide a line patterned layer.

A region 2100 can be accessed by a handler (e.g., a transfer robot),such as to allow placement of a substrate in the region 2100 of a firstzone Z1 before printing the liquid coating (e.g., as indicated by anarrow toward the region 2100). The substrate can then be supported atleast in part by pressurized gas such as in the region 2100 of the firstzone Z1. The printing system can have a second region 2200 in the firstzone Z1, such as providing a combination of pressurized gas and vacuumto more precisely control a floatation “fly height” of the substrate,such as during or after a printing operation. Further discussion ofusing pressure-only or a combination of pressure and vacuum is providedin relation to the illustrative example of FIG. 7, below.

Referring back to FIG. 1, the substrate can be conveyed at least in partusing a floatation table located in the first zone Z1. Such conveyancecan be augmented or otherwise facilitated by mechanical engagement ofthe substrate, such as including use of one or more of rollers orgrippers (e.g., a vacuum gripper), as discussed further in examplesbelow. One or more of the first, second, or third zones Z1, Z2, or Z3can be configured to continuously support the substrate at least in partusing a gas cushion. For example, after a printing operation, thesubstrate can be conveyed to a third zone Z3 included as a portion of atreatment system 3000, such as via a second zone Z2, such as along apath indicated by the curved line including arrows. Such conveyance caninclude continuing to support the substrate at least in part using thegas cushion during conveyance and through treatment. The treatmentsystem 3000 can treat a liquid coating (e.g., a printed liquid ink) toprovide a solid layer on the substrate.

As mentioned above, treatment of the liquid ink can include one or moreof light exposure (e.g., including one or more of ultraviolet,infra-red, or visible light), heating or cooling, higher-than-ambientpressure or vacuum. Such treatment can result in solidification ofliquid ink to provide the solid layer through one or more of removal ofa carrier fluid (e.g., one or more of drying or baking, such asincluding vacuum drying or vacuum baking), chemical reaction (e.g.,cross linking or chemical transformation from one compound to another),or densification (e.g., baking, such as including vacuum baking). Theprinted layer can be patterned or blanket coated over the substrate, andcan coat or can be included as part of a light emitting device (e.g., adisplay or lighting panel), a light absorbing device (e.g.,photodetector or solar cell), a printed circuit assembly, or otherelectronic device or circuit.

For example, the treatment system 3000 can include one or more sourcesof light (e.g., one or more visible, infra-red, or ultraviolet sourcessuch as a source 910). The source 910 can include a linear array of“bar” source, such as can include an array of ultraviolet light-emittingdiodes, as discussed in relation to other examples herein. One or moreof the substrate or the source 910 can be translated or scanned, such asto achieve a desired controlled duration or dose of light exposure overa specified region of the substrate. Such light exposure can be used toheat a substrate (e.g., using infra-red or visible light), or to elicita chemical reaction (e.g., cross linking or chemical transformation).The treatment need not include using light. For example, the treatmentsystem 3000 can be configured to heat or cool the substrate, or toprovide an environment for the substrate to evolve from one state toanother.

For example, treatment can include baking or drying the substrate usingheating. Such heating can be one or more of convectively-driven (e.g.,using the gas cushion or establishing other gas flow) or radiativelydriven (e.g., using one or more sources such as lamps providing infraredradiation). As discussed in other examples below, a temperature of thesubstrate during treatment in the treatment zone 3000 or elsewhere canbe controlled, such as using one or more of the controlled applicationof temperature-controlled gas flow across the substrate surface, such aslaminar flow, which can be provided to flow across the plane of thesubstrate, or using a temperature-controlled flow provided as a portionof the gas cushion used to support the substrate. Such convectivetechniques can be used to treat the substrate to bake or dry the liquidcoating to solidify the liquid coating, providing the solid layer. Suchconvective techniques can be combined with radiative treatment, such ascan include using infra-red lamps to one or more of bake or dry theliquid coating. Treatment can include providing environment to densifyone or more layers on the substrate, such as can including a bakingoperation. In another example, at least a partial vacuum environment canbe used during treatment, such as can also include radiative treatmentof the substrate.

In an example, the substrate can be held for a specified duration (oruntil specified criteria are met), after a printing operation but beforea treatment operation, such as to allow the substrate to evolve from onecondition to another. In the case of holding for the purpose of evolvingthe substrate, for example, the substrate can be held so as to allow fora printed liquid layer to settle or flow. As in the example above, atemperature of the substrate during such evolution can be controlledthrough the controlled application of temperature-controlled gas flowacross the substrate surface, such as laminar flow, which can beprovided to flow across the plane of the substrate.

Holding can be performed with the substrate located in either of regions2100 or 2200 of the first zone Z1. For example, a first substrate can bekept stationary in the printing zone Z1 after a printing operation for aspecified holding duration. However, throughput can be enhanced such asby conveying a substrate to the second zone Z2 and using at least aportion of the second zone Z2 as a holding zone or to perform one ormore other operations. For example, another substrate can be deliveredto the first zone Z1 of the system 2600 for a printing operation and thefirst substrate can be conveyed to the second zone Z2 to vacate theregion where printing occurs. If the second zone is elongated, a seriesof substrates can be held or conveyed serially through zone Z2. Thesecond zone Z2 can also be used for queueing or buffering a series ofsubstrates awaiting treatment or other processing (e.g., the substratesneed not be held in zone Z2 only for a specified duration, or only forevolution from one state to another), or processing can be performed inthe second zone Z2 such as can include one or more of baking or dryingthe substrate. Other configurations can be used, such as shown in theexample of FIG. 2, FIG. 3A, FIG. 3B, FIG. 3C, or FIG. 3D. In addition orinstead, the third zone Z3 can be used to hold the substrate for aspecified duration after printing but before treatment.

The coating system 2600 can be located within an enclosure 1010, such asto provide a controlled processing environment at or near atmosphericpressure. Such a controlled processing environment can be established toremain below specified limits of one or more of particulatecontamination level, water vapor content, oxygen content, ozone contentand organic vapor content. For example, the controlled processingenvironment can include nitrogen or another gas or mixture of gasesspecified for minimal or no reactivity with a species deposited on asubstrate being processed using the system 2600. As described in otherexamples below, such a controlled processing environment can beestablished at least in part using a gas purification system includedwithin or coupled to various portions of the system 2600. A particulatelevel of the controlled environment can also be controlled, such asusing apparatus coupled to the system 2600 or located within the system2600. In an example, the enclosure 1010 can include an environmentestablished without a pressurized inert gas recirculation system, suchas can include an enclosure 1010 maintained at a slightly positiveinternal pressure relative to an external pressure in order to safeguardagainst outside gas or air from entering the interior should any leaksdevelop in the enclosure 1010. According to various illustrativeexamples, an enclosure 1010 and system 2600 of the present teachings,the interior of the enclosure 1010 can be maintained at a pressurerelative to the surrounding atmosphere external to the enclosure 1010,for example, of at least 2 mbarg, for example, at a pressure of at least4 mbarg, at a pressure of at least 6 mbarg, at a pressure of at least 8mbarg, or at a higher pressure.

FIG. 2 illustrates generally an example of a plan view of at least aportion of a coating system 2700, such as can include two or moreprinting zones and treatment zones. FIG. 2 can include two or morecoating systems 2600A or 2600B, such as each having a configurationidentical or similar to the configuration of the system 2600 discussedabove in relation to FIG. 1. In FIG. 2, a substrate 4000 can betransported into a zone Z1A of a first coating system 2600A, such assupported at least in part using a gas cushion provided by a floatationtable in a printing zone Z1A during a printing process. For example, ahandler 2732 including an end effector 1420 can be used to manipulatethe substrate 4000, such as to place the substrate 4000 in position forprinting or treatment operations in zone Z1A, or to retrieve a substrateafter such operations, such as from zone Z3A. In the illustrativeexample of FIG. 2, the handler 2732 can traverse a track 2734 inaddition to having other degrees of freedom.

The substrate 4000 can be transferred within the coating system 2600Ausing a floatation stage conveyance system, such as through a secondzone Z2A, using various transport techniques. Such techniques caninclude using one or more of a linear air bearing or mechanical bearingsystem, a gripper assembly for holding the substrate, rollers, or thelike. As previously discussed herein, the substrate 4000 can be retainedin a holding zone for a specified hold duration or for a durationdetermined by a latency of other processing activities, such as after aprinting process has been completed and before a treatment operation.During such a holding operation, the substrate 4000 can continue to besupported at least in part using a gas cushion.

The substrate 4000 can be transported to a treatment zone Z3A, such asincluded as a portion of a treatment system 3000A. As discussedelsewhere herein, a substrate 4000 can be treated using varioustechniques such as to form a solid layer by solidfying the liquid layer.Such treatment can result in solidification of liquid ink to provide thesolid layer through one or more of removal of a carrier fluid (e.g., oneor more of drying or baking, such as including vacuum drying or vacuumbaking), chemical reaction (e.g., cross linking or chemicaltransformation from one compound to another), or densification (e.g.,baking, such as including vacuum baking). During processing within thecoating system 2600A, the substrate 4000 can be supported at least inpart using a gas cushion during an entire sequence of processingoperations including one or more of printing, holding, and treatment.

The present inventors have recognized, among other things, that in thismanner a number of handling steps including a robot (e.g., a handler2732) can be reduced, such as for one or more of reducing latency,reducing mechanical damage to the substrate during engagement by thehandler 2713, or enhancing uniformity of a solid layer (e.g., a filmlayer) provided by the coating system 2600A. The various transporttechniques mentioned above can be used to convey a substrate through thecoating system 2600A, such as contacting the substrate in specifiedregions other than a display region or area of a substrate includingelectronic devices being fabricated, or supporting the substrate atleast in part using a gas cushion opposite such regions.

The system 2700 can include a second coating system 2600B, such asconfigured similarly to the first coating system 2600A, such as includefirst, second, and third zones Z1B, Z2B, and Z3B, along with a printingsystem 2000B, and a treatment system 3000B. The second coating system2600B can be configured to print a liquid layer, and then treat theliquid layer to provide a solid layer in a manner similar to the firstcoating system 2600B. In this manner, the second coating system 2600Bcan provide one or more of redundancy or enhanced throughput as comparedto a topology having only a single printing system 2000 or a singlecoating system 2600A or 2600B. In an example, a solid layer provided bythe second coating system 2600B can be different from the layer providedby the first coating system block 2600A (e.g., in composition orlocation being coated on the substrate).

The system 2700 can include various enclosures, such as a firstenclosure 1010A for the first coating system block 2600A, and anenclosure 1010B for a second coating system block 2600B. The enclosurescan each have a controlled environment as discussed in relation to otherexamples herein. The handler 2732 can be located within a transfermodule 1400B also having a controlled environment. The internalenvironment of the transfer module 1400B can be commonly maintained withone or more of the first or second coating system blocks 2600A or 2600B,or maintained separately. For example, one or more gate valves or gascurtain arrangements can be used in the regions where the handler 2732places or retrieves substrates from the first or second coating systemblocks 2600A or 2600B.

The system 2700 can include one or more other modules, such as first orsecond modules 1100A or 1100B, which can include one or more of apass-through or load-lock arrangement. For example, the module 1100B(e.g., an “output” module) can include a load-lock arrangementconfigured at least in part to transition a substrate 4000 from a firstenvironment within the transfer module 1400B to another environmentdifferent from the environment of the transfer module 1400B (e.g.,to/from a pressure at or near atmospheric pressure from/to a vacuumenvironment, or from/to an atmospheric environment having differentcontrolled characteristics such as one or more of gas, moisture,particulate, or other compositions). Similarly the module 1100A (e.g.,an “input module”) can include a load-lock arrangement or a pass-througharrangement. Another transfer module 1400A can include a handler 1410,such as to place a substrate 4000 into the module 1100A or retrieve asubstrate 4000 from the module 1100A. Other modules can be included,such as a first processing or holding module 1200A, or a secondprocessing or holding module 1200B. Such processing or holding modules1200A or 1200B can include a stacked arrangement of substrate 4000locations, such as shown illustratively in the examples of FIG. 13A orFIG. 13B. Such stacked arrangements can be used for holding substratesbefore or after processing, or for other purposes. For example, inaddition to simply holding substrates for the purpose of substrate flowmanagement, such as holding a substrate for a period of time untilanother module is ready to receive it or providing a place to holddefective or damaged substrates until they can be removed, a processingor holding module can also be used to hold substrates for a period oftime as a part of a functional process flow.

The first module 1100A or second module 1100B can be coupled to a vacuumsource, or a purge source, or both, and can be configured forindependently sealing an interface port to system 2700 and the interfaceport to the prior or next environment (which could be the ambientenvironment or a controlled environment associated with another enclosedprocessing module). In this manner, the first or second modules 1100A or1100B can internally seal and transition the internal environment of themodules 1100A or 1100B between one that is not compatible with otherportions of system 2700 to one that is compatible (e.g., a controlledenvironment at about atmospheric pressure or above atmospheric pressurethat when exposed to system 2700 via the interface port wouldsubstantially maintain the quality of the controlled environment insystem 2700). Similarly, the first module 1100A or second module 11008can be used to transfer the substrate to an environment suitable forother processing (e.g., a second environment at or near atmosphericpressure but having a different composition than the controlledenvironment, or a vacuum environment). In this manner, the first orsecond modules 1100A or 11008 can provide a transfer conduit between thecontrolled environment of the system 2700 and other apparatus. The firstmodule 1100A or other modules can include a permanently-attachedconfiguration, or a cart or other transportable configuration.

In an example, a module (e.g., the first module 1100A or the secondmodule 1100B) can then be provided with a non-reactive atmosphere orotherwise “charged” using a purified gas stream, such as including oneor more purge operations, to prepare an interior region of the loadingmodule (e.g., the first module 1100A or the second module 11008) forexposure to interior portions of the enclosed system 2700. For example,an internal region of one or more of the modules can be at leastpartially evacuated or purged in order to avoid contamination in amanner exceeding the specified limits of particulate contaminationlevel, water vapor content, oxygen content, ozone content, and organicvapor content of the controlled processing environment within anenclosed region defined by other portions of the system 2700.

Similarly, after processing by the system 2700, a substrate beingprocessed can be placed in the first or second modules 1100A or 1100B.As an illustration, a module (e.g., the first module 1100A or the secondmodule 1100B) can be isolated from a non-reactive gas environmentelsewhere in the system 2700, such as coupled to a vacuum source to beevacuated for subsequent processing under vacuum conditions, orotherwise for transport of the substrate being fabricated to otherapparatus or processing under vacuum conditions, ambient conditions, orsome other static controlled environment. As a further illustration, oneof the first or second modules 1100A or 1100B can be configured toprovide the substrate to the controlled processing environment withinthe system 2700 without raising a concentration of a reactive species bymore than, for example, 1000 parts per million within the enclosedregion or similarly, without raising the ambient particle levels by morethan a specified amount, or without depositing more than a specifiednumber of particles of specified size per square meter of substrate areaonto the substrate.

In an example, the first module 1100A can be coupled to other modules bya port (e.g., including a physical gate having a substantially gasimpermeable seal) or gas curtain. When the port is opened, an interiorof the first module 1100A can be accessed by a handler located in thefirst transfer module 1400A. The handler 1410 can include a roboticassembly having various degrees of freedom, such as to manipulate asubstrate using an end effector. Such an end effector can include afork, tray, or frame, for example, configured to support the substrateby gravity, or the end effector can securely grasp, clamp, or otherwiseretain the substrate, such as to allow reorientation of the substratefrom a face-up or face-down configuration to one or more otherconfigurations. Other end effector configurations can be used, such asincluding pneumatic or vacuum-operated features to either actuateportions of the end effector or otherwise retain the substrate. Furtherillustrative examples of transfer modules including handlers aredescribed below.

Other coating system configurations can be used, such as having aspectssimilar to the examples of FIG. 1 or FIG. 2, but having different lineconfigurations or “topologies.” For example, FIGS. 3A through 3Dillustrate generally further examples of plan views of at least aportion of a coating system. FIG. 3A illustrates generally a coatingsystem 2800A that can be referred to as a “U” configuration, such as forproviding a liquid layer, and treating the liquid layer to provide asolid layer. The system 2800A can include a printing system 2000, suchas having a first zone Z1 including a floatation table apparatusconfigured to support a substrate 4000 at least in part using a gascushion, as in other examples. Second zones Z2A through Z2N can be usedas holding or processing regions 5000A through 5000N, such as to hold aseries of substrates before or after a printing operation includingcontinuing to support the substrate at least in part using a gascushion. A treatment system 3000 can be provided, such as having a thirdzone Z3.

In an in-line example, a substrate 4000 can be introduced into thesystem 2800A such as through a first module 1100A. The substrate can bemanipulated by a handler 2732, such as located within a transfer module1400B, and placed upon a floatation table in zone Z1 for a printingoperation. The substrate 4000 can be conveyed along zone Z1 to zones Z2Athrough Z2N, and then to zone Z3 for a treatment operation. Duringtraversal or operations in zone Z1, zones Z2A through Z2N, and zone Z3,the substrate 4000 can be supported at least in part using a gascushion, such as continuously supported. Other transport techniques canbe used in addition to the gas cushion arrangement, as mentioned above.Upon completion of a sequence of at least one printing and treatmentoperation, the substrate can be retrieved by the handler 2734 and placedin a second module 1100B, such as for further processing. If a secondprinting system is included, the topology of FIG. 28A can expand to forman “M” configuration. The inclusion of one or two printing systems(e.g., printing system 2000) is illustrative, and additional printingsystems can be included, such as to enhance throughput, increaseredundancy, or to provide additional processing operations.

FIG. 3B illustrates generally a system 2800B that can include a “partialcarousel” configuration, such as including a rotating portion 3001(e.g., a platform, chamber, or other configuration) that can rotate toallow conveyance of a substrate to various portions of the system 2800B.As in other examples, a substrate 4000 can be introduced such as to afirst module 1100A, where a handler 1410 can retrieve the substrate 4000and place it in zone Z1 for a printing operation. The substrate 4000 canthen be conveyed to one of zones Z2A or Z2B, such as for a holdingoperation or other processing in holding or processing regions 5000A or5000B, including continuing to support the substrate 4000 at least inpart using a gas cushion. The substrate 4000 can be conveyed back tozone Z1 and then, after rotation of the rotating portion 3001, thesubstrate 4000 can then be conveyed to zone Z3, such as for a treatmentoperation. In an example, the substrate 4000 can be conveyed directlyfrom zone Z1 to zone Z3 without requiring holding or other processing inzones Z2A or Z2B. For example, if zones Z2A or Z2B are occupied, holdingor other processing can occur in the printing zone Z1, or the treatmentzone Z3. After printing and treatment, the substrate can be conveyedback to a location along zone Z1, such as for retrieval by the handler1410. The substrate can be returned to module 1100A or placed in anothermodule 1100B, such as for further processing. In other examples, otherfloatation table conveyance structures could extend radially indirections other than toward zone Z1.

FIG. 3C illustrates generally an “arc” topology, such as can include atransfer module 1400C that connects with various portions of the system2800C at points radially located around the transfer module 1400C. Forexample, a substrate 4000 can be introduced to the system 2800C such asvia a first module 1100A. A handler 1410 can retrieve the substrate 4000from the first module 1100A and place it in zone Z1, such as for aprinting operation using a printing system 2000. The substrate 4000 canthen be conveyed to a region 5000A in zone Z2A such as remainingstationary in zone Z2A for a specified duration, or traversing zones Z2Athrough Z2N including regions 5000A through 5000N over a specifiedduration. The substrate 4000 can be treated in a treatment region 3000,and then retrieved by the handler 1410, such as for placement back inthe module 1100A or in an output module, such as the module 1100B.

FIG. 3D illustrates generally a further example of a view of at least aportion of a system 2800D that can be used in providing a solid coatingon a substrate 4000. The system 2800D can include a stackedconfiguration for at least a portion of the system. While the examplesof FIG. 3A, FIG. 3B, and FIG. 3C generally illustrate a single substrateelevation (e.g., a substrate is conveyed laterally from operation tooperation substantially in the plane of the substrate itself), suchexamples can be combined with other examples described herein, such asincluding one or more portions having a stacked configuration. Thesystem 2800D can include a module 1100A, such as input module, such ascoupled to a transfer module 1400B. The transfer module 1400B caninclude a handler 2732, such as can traverse a track 2734 to accessother portions of the system 2800D. The transfer module 1400B can becoupled to other portions of the system 2800, such as a module 1100B(e.g., an output module), or one or more other modules such as a holdingor processing module 1200A or a holding or processing module 1200B.

The handler 2732 can provide a substrate to a first zone Z1 nearby aprinting system 2000, such as for deposition (e.g., printing) of aliquid ink layer on the substrate 4000. The substrate 4000 can then beconveyed via a floatation stage conveyance system 2630 to a specifiedone of a stacked array of zones Z2A through Z2N in a region 5000. Suchzones Z2A through Z2N can be lowered or raised, for example, so that thespecified one of the stacked array is aligned laterally in substantiallythe same plane of the printing zone Z1 for conveyance of the substrate.After holding for a specified duration or undergoing other processing inthe region 5000, or until availability of zone Z3, such as included as aportion of a treatment system 3000, the specified one of the zones Z2Athrough Z2N can be aligned with zone Z3, and the substrate can beconveyed via floatation to zone Z3. In the example of FIG. 3D, the zoneZ3 is shown as having about the same elevation as Z1, but this need notbe the case. For example, the treatment zone Z3 can be at a differentelevation than the zones Z2A through Z2N, or the printing zone Z1.

As in the other examples above, during operations such as printing ortreatment within the system 2800D, the substrate 4000 can be supportedat least in part on a gas cushion throughout a sequence of process, suchas reducing one or more of handling steps or mechanical contact betweenthe substrate 4000 and the processing apparatus. Without being bound bytheory, it is believed that such reduction of handling steps involvingthe handler 2732 or reduction of mechanical contact can enhance acoating layer uniformity, such as by helping to suppress formation orcirculation of particulate contaminants or by helping to suppressnon-uniformities across the substrate due to a thermal or electrostaticnon-uniformities.

FIG. 4A illustrates generally a technique 6001, such as a method, thatcan include forming a coating on a substrate, such as can include usingthe systems shown in the examples of FIG. 1, 2, or 3A through 3D. Duringcertain operations, such as during one or more of printing, holding, ortreatment, a substrate can be supported by a floatation apparatus usinga pressurized gas or a combination of pressurized gas and vacuum. At6101, a substrate can be transferred to a coating system. For example,the substrate can be processed elsewhere such as having one or morelayers fabricated upon the substrate. As mentioned above, the substratecan include layers that are patterned or blanket coated over thesubstrate, and such layers can coat or can be included as part of alight emitting device (e.g., a display or lighting panel), a lightabsorbing device (e.g., photodetector or solar cell), a printed circuitassembly, or other electronic device or circuit.

At 6201, the substrate can be supported in the coating system, such asat least in part using a gas cushion provided to side of the substrateopposite the region where the patterned solid layer is to be formed,such as including continuing to support the substrate at least in partusing the gas cushion. At 6301, a liquid coating can be deposited on thesubstrate, such as using a printing technique. Broadly, the printingoperation can include one or more liquid coating processes, such asinkjet printing, nozzle printing, slot die coating (patterned orun-patterned), or screen printing, and the liquid ink can comprise oneor more of an organic material (e.g., a monomer or a polymer) or aninorganic material, and can include a carrier fluid.

Optionally, at 6401, the substrate can be held, such as in a region orzone arranged for such holding (e.g., a zone located along or includedas a part of a floatation table arrangement). Such holding can occur fora specified fixed duration or can be specified to include sufficientduration to permit the substrate to transition or evolve from one stateto another different state. Such holding can also be established atleast in part by a latency or availability of other processing areas,such as a treatment area. During the holding operation, the substratecan continue to be supported at least in part by a gas cushion. At 6501,the substrate can be conveyed to a treatment zone, including continuingto support the substrate at least in part using the gas cushion. In anexample, the conveyance at 6501 can occur before the optional holdingmentioned at 6401. In another example, the optional holding mentioned at6401 can occur while the substrate is still located in the printingzone.

At 6601, the liquid coating provided at 6301 can be treated. Treatmentof the liquid ink can include one or more of light exposure (e.g.,including one or more of ultraviolet, infra-red, or visible light),heating or cooling, higher-than-ambient pressure or vacuum. Suchtreatment can result in solidification of liquid ink to provide thesolid layer through one or more of removal of a carrier fluid (e.g., oneor more of drying or baking, such as including vacuum drying or vacuumbaking), chemical reaction (e.g., cross linking or chemicaltransformation from one compound to another), or densification (e.g.,baking, such as including vacuum baking). In the example of FIG. 4B,such treatment includes exposure to ultraviolet light, such as toprovide a patterned solid layer corresponding to the region or regionswhere the liquid ink was deposited.

Portions of an electronic device, such as a light emitting or lightabsorbing device, can be encapsulated using one or more film layersdeposited upon a device being fabricated upon a substrate. In anexample, such film layers can include a stack or other configuration oflayers comprising inorganic and organic materials. FIG. 4B illustratesgenerally a technique 6002, such as a method, that can include formingan organic encapsulation layer (OEL), such as can include using one ormore aspects of the coating systems shown in the examples of FIG. 1, 2,or 3A through 3D. Such an OEL can be included as a portion of anencapsulation structure.

At 6102, a substrate can be transferred to an enclosed organic thin filmencapsulation system configured to deposit a layer (e.g., a patternedorganic layer) in a specified region on a first side of the substrate,the organic layer coating at least a portion of a device fabricated uponthe substrate. At 6202, the substrate can be supported in the enclosedthin film encapsulation system at least in part using a gas cushionprovided to a second side of the substrate opposite the specifiedregion. At 6302, a liquid ink, which can be in an example an organicmonomer-based ink, can be printed (e.g., inkjet printed) over thespecified region of the substrate with the substrate located in aprinting zone including the printing system while the substrate issupported at least in part by the gas cushion. At 6402, the substratecan be conveyed to a holding zone and the substrate can be held for aspecified duration including continuing to support the substrate atleast in part using the gas cushion. At 6502 the substrate can beconveyed to a treatment zone, including continuing to support thesubstrate at least in part using the gas cushion. As mentioned inrelation other examples, conveyance of the substrate to the treatmentzone can occur before or after holding, and the holding operation neednot be performed in a holding zone. For example, such holding can beperformed instead or in addition in one or more of the printing zone orthe treatment zone.

At 6602, the substrate can be treated, including treating the liquidink, which can be in an example an organic monomer-based ink, to providea polymerized organic layer upon the substrate in the specified region,the treatment occurring while the substrate is continuing to besupported at least in part using the gas cushion. The patterned organiclayer can include a portion of an encapsulation structure, the structureestablished to encapsulate at least a portion of light-emitting deviceson the substrate.

FIG. 5 illustrates generally an example depicting various regions of asubstrate 4000 such as can be supported at least in part usingpressurized gas ports or pressurized gas regions, or a combination ofsuch pressurized gas along with vacuum ports or vacuum regions. Asubstrate 4000 can include a glass material or one or more othermaterials. In the illustrative example of flat panel displays, thesubstrate 4000 can include either a single large display or two or moresmaller displays that can be singulated from the substrate 4000. In theillustrative example of FIG. 5, four display regions 4002A, 4002B,4002C, and 4002D are shown. These can be referred to as “active” regionsor “emitting regions,” for example. Use of the term “active” in thisexample does not somehow imply that such regions are actually opticallyemissive during processing, but instead refers to regions that caninclude devices configured to emit light or regions that otherwise forman emissive or transmissive portion of a display that is visible to anend user. Generally, visible defects in the regions 4002A through 4002Dwill be deemed unacceptable by end users, and accordingly varioustechniques can be used such as to enhance a visible uniformity of theregions 4002A through 4002D. Other variations in panel configuration ofthe substrate 4000 are possible. For example, a substrate 4000 caninclude a single display or array of OLED devices. In other examples,the substrate 4000 can be divided up into two, four, or eight regions,such as establishing corresponding perimeters for support, or such ashaving corresponding distributed porous media regions as mentioned inother examples herein. For other manufacturing examples in which otherdevices, such as optical, electrical, or optoelectronic devices, are onthe substrate and being coated, such as being coated with an organicencapsulation layer, the definition of “active” can be adjusted tosuitably encompass the regions corresponding to those devices. Examplesof such devices can include electronic circuits, solar cells, printedcircuit boards, and flat panel displays.

In an example, support can be provided during processing such as using apressurized gas cushion established on a surface underneath thesubstrate in the display regions 4002A through 4002D. Region 4004extending around the periphery of the substrate 4000 and extending intothe interior spaces between each of the display regions 4002A through4002D can be engaged by physical contact between the substrate andfixtures, such as can include on or more of grippers, rollers, liftpins, or other fixtures. Such a region 4004 can be referred to as a“keep out” area, indicating that emitting or active elements of thedisplay (or other elements as mentioned above in relation to other typesof devices other than displays) can be kept clear of such engagementregions (or vice versa). For example, one or more “lift pins” can belocated in an area as shown illustratively in FIG. 5, such as in a firstregion 2124A, a second region 2124B (e.g., in a location between displayregions 4002A and 4002B), and an “Nth” region 2124N. Such lift pins canprovide increased clearance between the substrate 4000 and one or moreports or distributed pressurized gas sources, such as can be used tosupport the substrate in the regions 4002A, 40028, 4002C, or 4002D.

A floatation platform or chuck can include a continuous array of smallpressure apertures, or a continuous porous plate, such as providing aflow of pressurized gas on which the substrate can float. Holes canstill be provided in the chuck surface, such as 2124A and 2124B, forexample, for lift pins (which when retracted sit below the chucksurface), but because the substrate floats above the chuck surface, thepresence of “mura” or non-uniformity in the coating over such holes canbe reduced or eliminated. In this way, even the interior regions inbetween regions 4002A through 4002D may be utilized as active regions,improve productivity and enabling the manufacture of a larger continuousactive device. As in yet other examples, a combination of pressurizedgas ports and vacuum ports can be used, such as shown and describedelsewhere. For example, the substrate 4000 can be retained such as byone or more vacuum ports (e.g., circular ports, or slots, for example)such as in the regions 2124A through 2124N as shown in region 4004.

As mentioned above, such a region 4004 can again include a periphery ofa substrate 4000. In an illustrative example, physical contact betweenthe substrate 4000 and any fixtures can generally be restricted to sucha periphery region 4004 during certain processing operations, such asduring one or more of deposition (e.g., printing of a material onsubstrate 4000), holding, treatment, or other processing. Such a region4004 can, for example, extend inward from the edges of the substrate by100 millimeters or 200 millimeters. Elsewhere, the substrate can besupported at least in part in the region 4002 using one or morepressurized gas ports. Such a combination of vacuum ports andpressurized gas ports can avoid imparting undue stress on a largesubstrate 4000 because the substrate can be supported physically in theperiphery region 4004, and supported at least in part by pressurized gasin the central region 4002. In this manner, it does not matter whetherthe substrate 4000 includes a single large display being fabricated, orseveral smaller displays. Therefore, a common conveyor or floatationtable configuration can be used for a variety of different displayconfigurations because contact can be restricted to a peripheral region4004 of the substrate 4000 while supporting the substrate 4000 (e.g.,centrally) with pressurized gas.

In processing where the substrate 4000 can be supported exclusively bythe gas cushion, a combination of positive gas pressure and vacuum canbe applied through the arrangement of ports or distributed regions. Sucha zone having both pressure and vacuum control can effectively provide afluidic spring between a floatation table or platform and the substrate4000. A combination of positive pressure and vacuum control can providea fluidic spring with bidirectional stiffness. The gap that existsbetween the substrate (e.g., substrate 4000) and a surface can bereferred to as the “fly height,” and such a height can be controlled orotherwise established by controlling the positive pressure and vacuumport states. In this manner, the substrate orientation can be carefullycontrolled such as for one or more of printing, holding, treatment, orother processing.

Elsewhere, such as where the fly height need not be controlledprecisely, pressure-only floatation zones can be provided, such as alonga conveyor or elsewhere. A “transition” zone can be provided such aswhere a ratio of pressure to vacuum nozzles or area increases ordecreases gradually, such as along a conveyor or table. In anillustrative example, there can be an essentially uniform height betweena pressure-vacuum zone, a transition zone, and a pressure only zone, sothat within tolerances, the three zones can lie essentially in oneplane. A fly height of a substrate 4000 over pressure-only zoneselsewhere can be greater than the fly height of a substrate 4000 over apressure-vacuum zone, such as in order to allow enough height so that asubstrate will not collide with a floatation table in the pressure-onlyzones.

In an illustrative example, a substrate can have a fly height of betweenabout 150 micrometers L L L L to about 300 μL above pressure-only zones,and then between about 10 L L to about 50 μL L above a pressure-vacuumzone. In an illustrative example, one or more portions of a floatationplatform or table can include an “air bearing” assembly provided byNewWay® Air Bearings (Aston, Pa., United States of America) or Coreflow(Israel). While the examples of gas pressurized support of a substrateare discussed in relation to FIG. 5, such techniques can be used inaddition to or instead of other conveyance or support approaches.

FIG. 6 illustrates generally a schematic representation of a gaspurification scheme that can be used in relation to portions orentireties of one or more other examples described herein, such as toestablish or maintain an controlled environment in an enclosure. Forexample, a gas enclosure system 502 can include a gas enclosure assembly100 (e.g., an enclosure having a controlled environment), a gaspurification loop 130 in fluid communication with the gas enclosureassembly 100, and a thermal regulation system 140 (e.g., as can bereferred to as a temperature controller in other examples herein).

The system 502 can include a pressurized gas recirculation system 300,which can supply gas for operating various devices, such as a substrateflotation table or other pressurized-gas devices, such as for thevarious coating system examples described herein. The pressurized gasrecirculation system 300 can include or use a compressor, a blower, orboth. Additionally, the gas enclosure system 502 can have a circulationand filtration system internal to gas enclosure system 502 (e.g., one ormore fan filter units (FFUs) as described in other examples herein).

One or more ducts or baffles can separate non-reactive gas circulatedthrough the gas purification loop 130 from the non-reactive gas that isotherwise filtered and circulated internally for various embodiments ofa gas enclosure assembly. For example, the gas purification loop 130 caninclude an outlet line 131 from the gas enclosure assembly 100. Asolvent removal component 132 can be provided, for solvent abatement,and gas to be purified can be routed from the solvent removal component132 to a gas purification system 134. Gas purified of solvent and otherreactive gas species, such as one or more of ozone, oxygen, and watervapor, can be circulated back to the gas enclosure assembly 100, such asthrough an inlet line 133.

The gas purification loop 130 can include appropriate conduits andconnections such as to interface with monitoring or control devices. Forexample, ozone, oxygen, water vapor, or solvent vapor sensors can beincluded. A gas circulating unit, such as a fan, blower, or otherarrangement, can be separately provided or integrated, for example, ingas purification system 134, such as to circulate gas through the gaspurification loop 130. In the illustration of FIG. 6, the solventremoval component 132 and gas purification system 134 are shown asseparate units. However, the solvent removal component 132 and gaspurification system 134 can be housed together as a single unit.

The gas purification loop 130 of FIG. 6 can have solvent removalcomponent 132 placed upstream of gas purification system 134, so thatgas circulated from gas enclosure assembly 100 can pass through solventremoval component 132, such as via an outlet line 131. In an example,the solvent removal component 132 can include a solvent trapping systembased on adsorbing solvent vapor from a gas passing through the solventremoval component 132. For example, a bed or beds of a sorbent, such asactivated charcoal, molecular sieves, or the like, can effectivelyremove a wide variety of organic solvent vapors. In another example, acold trap technology can be used to remove solvent vapors as a portionof the solvent removal component 132. Sensors, such as ozone, oxygen,water vapor and solvent vapor sensors, can be used to monitor theremoval of such species from gas continuously circulating through a gasenclosure system, such as gas enclosure system 502. For example,information obtained from such sensors or other devices can indicatewhen sorbent, such as activated carbon, molecular sieves, or the like,have reached capacity or have otherwise become less effective, so thatthe bed or beds of sorbent can be regenerated or replaced, for example.

Regeneration of a molecular sieve can involve heating the molecularsieve, contacting the molecular sieve with a forming gas, a combinationthereof, or the like. For example, molecular sieves configured to trapvarious species, including ozone, oxygen, water vapor, or solvents, canbe regenerated by heating and exposure to a forming gas. In anillustrative example, such a forming gas can include hydrogen, forexample, a forming gas comprising about 96% nitrogen and about 4%hydrogen, with said percentages being by volume or by weight. Physicalregeneration of activated charcoal can be done using a procedure ofheating under a controlled environment.

A portion of the gas purification system 134 of the gas purificationloop 130 can include systems available, for example, from MBRAUN Inc.,of Statham, N.H., or Innovative Technology of Amesbury, Mass.. The gaspurification system 134 can be used to purify one or more gases in gasenclosure system 502, for example, to purify the entire gas atmospherewithin a gas enclosure assembly. As mention above, in order to circulategas through gas purification loop 130, the gas purification system 134can have a gas circulating unit, such as a fan or blower, for example. Agas purification system can be selected or configured depending on thevolume of the enclosure, which can define a volumetric flow rate formoving a non-reactive gas through a gas purification system. In anillustrative example, a gas enclosure system having a gas enclosureassembly can include a volume of about 4 cubic meters and a gaspurification system that can move about 84 cubic meters per hour can beused. In another illustrative example, a gas enclosure system having agas enclosure assembly can include a volume of about 10 cubic meters anda gas purification system that can move about 155 cubic meters per hourcan be used. In yet another illustrative example, a gas enclosureassembly having a volume of between about 52 to about 114 cubic meters,more than one gas purification system can be used.

Gas filters, dryers, or other purifying devices can be included in thegas purification system 134. For example, a gas purification system 134can include two or more purifying devices, such as in a parallelconfiguration or otherwise arranged such that one of the devices can betaken off line for maintenance and one or more other devices can be usedto continue system operation without interruption. For example, the gaspurification system 134 can comprise one or more molecular sieves, suchas at least a first molecular sieve and a second molecular sieve, suchthat, when one of the molecular sieves becomes saturated withimpurities, or otherwise is deemed not to be operating efficientlyenough, the system can switch to the other molecular sieve whileregenerating the saturated or non-efficient molecular sieve. A controlunit can be provided for determining the operational efficiency of eachmolecular sieve, for switching between operation of different molecularsieves, for regenerating one or more molecular sieves, or for acombination thereof. As previously mentioned, molecular sieves can beregenerated and reused.

The thermal regulation system 140 of FIG. 6 can include at least onechiller 142, which can have a fluid outlet line 141 for circulating acoolant into a gas enclosure assembly, and fluid inlet line 143 forreturning the coolant to the chiller. An at least one fluid chiller 142can be provided for cooling the gas atmosphere within gas enclosuresystem 502. For example, the fluid chiller 142 can deliver cooled fluidto heat exchangers within the enclosure, where gas can be passed over afiltration system internal the enclosure. At least one fluid chiller canalso be provided with gas enclosure system 502 to cool heat evolvingfrom an apparatus enclosed within gas enclosure system 502. In anillustrative example, a fluid chiller can also be provided for gasenclosure system 502 to cool heat evolving from a coating system. Athermal regulation system 140 can include heat-exchange or Peltierdevices and can have various cooling capacities. For example, a chillercan provide a cooling capacity of from between about 2 kilowatts (kW) toabout 20 kW of capacity. According to various examples, the gasenclosure system 502 can have a plurality of fluid chillers that canchill one or more fluids. A fluid chiller can use various fluids as aheat transfer medium, for example, such as water, anti-freeze, arefrigerant, or combination thereof. Leak-free, locking connections canbe used in connecting the associated conduits and system components.

While the examples above mentioning cooling capacities and chillingapplications, the examples above can also be applied to applicationswhere including buffering of substrates in a controlled environment, orfor applications where circulating gas can be maintained at atemperature similar to other portions of the system, such as to avoidunwanted heat transfer from substrates being fabricated or to avoiddisruption of temperature uniformity across a substrate or betweensubstrates.

FIG. 7 illustrates generally an example of at least a portion of asystem 505 for integrating and controlling one or more gas or airsources, such as to establish floatation control zones included as aportion of a floatation-based support or conveyance system. Such asystem 505 can include a table 2250 such as having various regionsconfigured to support a substrate by establishing a gas cushion. In thisillustrative example, regions 2100, 2200, and 2300 can be referred to asinput, printing, and output for illustration only. Such regions can beused for other processing steps, such as conveyance of a substrate, orsupport of a substrate such as during one or more of holding, drying,baking, or other treatment, or other processing of the substrateaccording to other examples. In the illustration of FIG. 7, a firstblower 3284A is configured to provide pressurized gas in one or more ofthe input or output regions 2100 or 2300 of a floatation tableapparatus. Such pressurized gas can be temperature controlled such asusing a first chiller 142A coupled to a first heat exchanger 1502A. Suchpressurized gas can be filtered using a first filter 1503A. Atemperature monitor 8701A can be coupled to the first chiller 142 (orother temperature controller).

Similarly, a second blower 3284B can be coupled to the printing region2200 of the floatation table. A separate chiller 142B can be coupled toa loop including a second heat exchanger 1502B and a second filter1503B. A second temperature monitor 8701B can be used to provideindependent regulation of the temperature of pressurized gas provided bythe second blower 3284B. In this illustrative example, the input andoutput regions 2100 and 2300 are supplied with positive pressure, butthe printing region 2200 can include use of a combination of positivepressure and vacuum control to provide precise control over thesubstrate position. For example, using such a combination of positivepressure and vacuum control, the substrate can be exclusively controlledusing the floating gas cushion provided by the system 504 in the zonedefined by the printing region 2200. The vacuum can be established by athird blower 3290, such as also provided at least a portion of themake-up gas for the first and second blowers 3284A or 3284B within theblower housing 3282.

FIG. 8A and FIG. 8B include illustrative examples of a chuck or tableconfiguration that can establish a pressurized gas cushion to support asubstrate, such as during one or more of a deposition (e.g., printing),holding, or treatment process, and a corresponding uniformity in aresulting processed substrate 4006C in FIG. 8C. FIG. 8A illustratesgenerally an example of a chuck 2420B configuration that includes portsconfigured to establish a pressurized gas cushion to support a substrate4006B, such as during one or more of a deposition, a holding operation,a material dispersing or flowing operation, or treatment process. Inthis approach, because the substrate 4006B is not required to contactthermally-non-uniform features of the chuck 2420B during variousprocesses, a substrate 4006B can avoid large and highly-visible mura.Different port configurations can be used, such as having a first portdensity in the region 2406A, and a second port density in the region2406B.

As mentioned in other examples herein, a fly height, “h” can beestablished such as by using a combination of vacuum and pressurized gasports, such as in the arrays of the regions 2406A and 2406B. Forexample, in each row of ports, the ports can alternate between beingassigned as a vacuum port or a pressurized gas port. In this manner,precise control of the height, h, can be established and the substrate4006B can be stabilized in the z-dimension with respect to the chucksurface. As in other examples herein, a combination of mechanicalanchoring and pressurized gas can also be used. For example, lateralmotion of the substrate 4006B (e.g., in a direction parallel a surfaceof the chuck) can be limited, such as by using one or more lateral stopsor bumpers, and conveyance of the substrate 4006B can be facilitatedusing one or more rollers or grippers, such as engaging the substrate ata periphery.

FIG. 8B illustrates generally examples of a chuck configuration thatincludes a porous medium 1906, such as to establish a distributedpressure during one or more of deposition, holding, treatment, or otherprocessing, such as providing uniformity in the resulting substrate4006C as shown in FIG. 8C. As mentioned in relation to other examplesherein, a porous medium 1906 “plate” such as coupled to or included as aportion of a chuck 2420C or floatation platform can provide a“distributed” pressurized gas cushion to support the substrate 4006C,such as without using large apertures as shown in FIG. 8A, and providinga substrate 4006C as shown in FIG. 8C having reduced or minimize theformation of mura or other visible defects. As mentioned in relation toother examples herein, a porous medium 1906 “plate” such as coupled toor included as portion of a chuck 2420C can provide a “distributed”pressure to uniformly float the substrate 4006C during processing, suchas without using individual apertures as shown in FIG. 8A.

A porous medium 1906 or similar distributed pressure or vacuum regionsas mentioned elsewhere herein, can be obtained such as from Nano TEMCo., Ltd. (Niigata, Japan), such as having physical dimensions specifiedto occupy an entirety of the substrate 4006C, or specified regions ofthe substrate such as display regions or regions outside displayregions. Such a porous medium can include a pore size specified toprovide a lifting force over a specified area, while reducing oreliminating mura or other visible defect formation such as duringholding, treatment, or other processing. Without being bound by theoryit is believed that use of a porous medium can enhance uniformity of acoating or film layer on the substrate 4006C, such as by reducing orminimizing mura or other visible defects associated with non-uniformthermal profile or electrostatic field profile across the surface of thesubstrate, or on a surface opposite the coating or film layer. Theporous medium can be coupled to a pneumatic supply, such as to provide agas cushion, or various porous media regions can be coupled to apneumatic supply and a vacuum supply, respectively, to provide a gascushion having a controlled “fly height,” such as in one or morespecified zones as mentioned above in relation to FIG. 7. When suchporous medium is used to provide a distributed pressure supply to floatthe substrate above the chuck surface, the presence of holes for liftpins (e.g., for retracted lift pins) need not cause visible defects in aresulting coating produced while the substrate is supported by the gascushion, therefore making a greater portion of the substrate areaavailable for the active regions.

FIG. 9 illustrates generally an example of a diagram illustrating atreatment system, such as can be configured to expose a substrate tolight, such as can be used in treating a coating on a substrate. Thetreatment system can be included as a portion of other systems ortechniques described herein, such as for use in a curing process or toperform operations including one or more of baking or drying a liquidink layer to solidify the liquid ink layer to provide a solid layer. Thetreatment system can include a light source assembly 912, such asconfigured to couple energy to a surface of a substrate 4000. The sourceassembly can include sources configured to emit one or more ofultraviolet (UV), infra-red (IR), or visible light. As in otherexamples, the treatment system 8314 can include a controlledenvironment, such as provided by one or more gas purification loops andcoupled to one or more fan-filter-units (FFUs), such as to provide anenvironment having a specified maximum level of particulates or reactivecontaminants.

The substrate 4000 can be conveyed to the treatment system 8314 such asusing a floatation table conveyance arrangement as mentioned in relationto other examples described herein. A table 920 can be used to supportthe substrate 4000, such as using a gas cushion arrangement as mentionedin other examples. One or more lift pins can be used, such as to elevatethe substrate 4000 further so that the substrate 4000 can be manipulatedby an end effector of a handler after treatment (e.g., after formationof a patterned solid layer on the substrate 4000).

In an illustrative example involving ultraviolet treatment, the array ofsources, such as sources 910A through 910N, can provide ultravioletenergy, such as including a wavelength selected from the range of about350 nanometers to about 400 nanometers. For example, a wavelength ofabout 385 nanometers or about 395 nanometers can be used. The sourcescan include a variety of configurations, such as using relatively smallnumber of high-power sources or using an array of relatively lower-powersources. The sources can include generally-available ultravioletemitters, such as ultraviolet-emitting light-emitting diodes (UV LEDs)or one or more mercury-based devices, such as one or more mercury arcsources. In another example, the sources 910A through 910N can includelamps or other sources such as can emit one or more of visible orinfra-red radiation. For example, the substrate can be heat treated suchas using an array of infra-red emitting sources.

In an example, a substrate or housing 918 of the source assembly 912 canbe liquid or air-cooled. For example, a plenum 914 can be provided, suchas having one or more blowers such as a blower 915 to force air acrossor through a portion of the source assembly 912. Such a cooling loop canbe separated from the controlled environment within the treatment system8314. An environment surrounding the sources 910A through 910N caninclude the treatment system 8314 controlled environment, or theenvironment surrounding the sources 910A through 910N can form aseparate enclosure, such as having a window 916 to allow energy to passfrom the source enclosure to the treatment system 8314. In this manner,maintenance of the source enclosure need not disturb the controlledenvironment within the treatment system 8314.

The window 916 need not be uniformly transmissive. For example, thewindow can include or can be coupled to optics to converge, diverge, orcollimate the energy. In another example, the window 916 can includetransmission characteristics that vary in a specified manner over thearea of the window, such as to invert or otherwise compensate for anon-uniform power density of delivered energy in the plane of thesubstrate 4000, such as within a specified region of the substrate. Inthe example of FIG. 9, the window and the sources 910A through 910N areshown as arranged in a planar configuration, but other configurationsare possible, such as a cylindrical, parabolic, or sphericalconfiguration. In an example the sources 910A through 910N can be usedto treat one or more organic material layers to encapsulate a devicebeing fabricated as a portion of the substrate 4000. Examples of suchdevices can include electronic circuits, solar cells, printed circuitboards, and flat panel displays. Such treatment can include providing aspecified dose of ultraviolet energy within a specified range ofwavelengths, and having a specified uniformity over a specified area ofthe substrate 4000.

A treatment process can generally be established in terms of a desireddose or dose-range of ultraviolet exposure, such as specified in termsof energy per unit area (e.g., Joules per square centimeter). Dose canbe calculated such as by multiplying incident power density by exposureduration. A trade-off can exist between intensity (e.g., incident power)and exposure duration. For example, a relatively high-power source canbe used and a desired dose can be achieved using a relatively shortexposure duration, which beneficially shortens processing time. However,high-power UV irradiation, for example, may damage or degrade otherportions of the display assembly, so a limit can exist as to the powerdensity provided at the substrate by an ultraviolet source such as toavoid such damage or degradation.

A uniformity of delivered ultraviolet energy can also be controlled,such as to avoid variation in coating layer characteristics over asurface of the substrate 4000. Uniformity can be specified in terms ofincident power or delivered dose, such as having a value of no more than20% variation from highest to lowest incident power or dose over aspecified curing area of the substrate 4000, or having no more than 50%variation from highest to lowest incident power or dose over thespecified curing area of the substrate 4000, or having no more than 10%variation from highest to lowest incident power or dose over thespecified curing area of the substrate 4000.

Various source configurations can be used for the sources 910A through910N. For example, a linear array or “bar” source can be used as shownin the configuration 8315 of FIG. 10A. Such a bar configuration caninclude a precision reflector, such as to focus or collimate the energyin a direction towards the substrate 4000. In another example, such abar configuration can include one or more of a diffuser or transmissivefilter, or a two-dimensional array configuration can be used. One ormore of these source configurations can be mechanically fixed, or can bescanned across a surface of the substrate. In such examples, either orboth the substrate 4000 or the sources 910A through 910N can be scanned.For example, the sources 910A through 910N can be fixed, and thesubstrate 4000 can be repositioned, such as to create a relative motionbetween the substrate 4000 and the sources 910A through 910N to achievescanning.

FIGS. 10A and 10B illustrate generally examples of at least a portion ofa treatment system 8315 that can include a linear configuration of lightsources, such as can be used in treating a coating on a substrate. In anexample, the treatment system 8315 can include a linear arrayconfiguration 910 of sources. The linear array 910 can be scanned in atleast one axis to sweep a beam of emission 922 (e.g., ultravioletemission) across a specified region of the substrate 4000. In anillustrative, such a region can include a region where a liquid ink,which can be in an example an organic monomer-based ink, has beendeposited and is to be cured or otherwise treated with ultravioletlight. Such scanning can be achieved through either or both ofrepositioning the substrate 4000 or the linear array 910, such as duringtreatment. A window 916 can be used, such as when the linear array 910is located in an enclosure separate from a chamber 8314 housing thesubstrate 4000. Such a window 916 can include or can be coupled to oneor more of optics or a filter.

The linear array 910 can offer an advantage of fewer sources (e.g.,about 5 to about 10 UV LED sources, in an illustrative example). But,such a linear area 910 may result in additional system complexity wheremechanical scanning is used to provide exposure to all of the specifiedarea of the substrate 4000. Mechanical scanning can be simplified inpart by specifying that the linear array 910 is at least as wide or as along as one axis of the substrate. In this manner, an entire width orlength of the substrate 4000 can be treated with light radiation whilescanning the linear array 910 “gantry” only in a single axis. The lineararray 910 can include a precision reflector configuration, as mentionedabove. As an illustrative example, a high-power UV LED light barsupplying light at or near 395 nm wavelength is available from PhoseonTechnology (Hillsboro, Oreg., USA), such as including a reflectorconfiguration to enhance uniformity of a field illuminated by the lineararray 910. In addition or instead of such a precision reflector, one ormore of a filter or diffuser can be used, such as statically configurednearby the window 916 or included as a portion of the window 916. Inanother example, one or more of a filter or diffuser can be included asa portion of the linear array 910 assembly, such as mechanically scannedas a portion of the linear array 910. In an example, the power densitysupplied by the linear UV source is between 20 mW/cm² and 400 mW/cm².

In FIG. 10B, a linear array 910 source height from an upward-facingportion of the substrate 4000 can be represented by “H,” a relativevelocity between the optical energy emitted by the array 910 and thesubstrate can be represented by “V.” The velocity can be established bymoving one or more of the array 910 relative to the substrate 4000(e.g., scanning the array mechanically) or the substrate 4000 relativeto the array, such as by either floating the substrate on a cushion ofgas or by moving a chuck 920 supporting the substrate. An illuminatedwidth can be represented by “W,” with such a width increasing as Hincreases and decreasing as H decreases. For dose modeling, a width ofthe array 910 can be multiplied by the illuminated width W to estimatean area of the substrate 4000 irradiated by the array 910.

Generally, in view of the large scale of substrates 4000 that can beaccommodated by the examples described herein, throughput is aconsideration. Accordingly, one objective can be to provide a light dosein a manner that the appropriate dose is delivered in a short or minimumamount of time, which can also reduce likelihood of damaging otherportions of the substrate 4000 either through reducing or minimizingexposure to energy from the source, or merely through reducing orminimizing the time during which the substrate is being processed.However, a tradeoff can exist between various processing parameters suchthat the velocity, dose of energy, and source height H are generally notarbitrarily established.

The examples above mention various techniques for treatment of asubstrate using light, such as to provide a solid coating layer bytreating a printed liquid ink layer. Other treatment techniques can beused, such as can include one or more of heating or cooling thesubstrate, radiatively baking or drying the substrate use of higherpressure gas flow as compared to other portions of a coating system, useof vacuum (or partial vacuum), and combinations thereof. Such treatmentcan result in solidification of liquid ink to provide the solid layerthrough one or more of removal of a carrier fluid (e.g., one or more ofdrying or baking, such as including vacuum drying or vacuum baking),chemical reaction (e.g., cross linking or chemical transformation fromone compound to another), or densification (e.g., baking, such asincluding vacuum baking). As mentioned in relation to other examplesherein, temperature control can be achieve using one or more of acontrolled temperature of pressurized gas use to support the substrate,or gas flow (e.g., laminar flow) such as established across a surface ofthe substrate, such as shown illustratively in relation to FIG. 13B.

FIG. 11A and 11B illustrate generally views a portion of a system, suchas including a transfer module, that can be included as a portion of acoating system or can be used to manipulate a substrate before or afterprocessing by a coating system. A controlled environment within variousenclosures of a system can include a controlled particulate level.Particulates can be reduced or minimized such as by using aircirculation units and filters, such as can be referred to as fan filterunits (FFUs). An array of FFUs can be located along a path traversed bythe substrate during processing. The FFUs need not provide a down-flowdirection of air flow. For example, an FFU or ductwork can be positionedto provide a substantially laminar flow in a lateral direction across asurface of the substrate. Such laminar flow in the lateral direction canenhance or otherwise provide particulate control.

In the example of FIG. 11A or FIG. 11B, one or more fan filter units(FFUs), such as FFUs 1500A, 1500B, 1500C, through 1500F, can be used toassist in maintaining an environment within the transfer module 1400Ahaving a controlled level of particulates or contaminants. Ducting suchas first and second ducts 5201A or 5201B can be used, such as to providea return air pathway as shown in the down-flow example of FIG. 11A. Acontrolled temperature can be maintained at least in part using atemperature controller 8700, such as coupled to one or more heatexchangers 1502. One or more temperature monitors, such as a temperaturemonitor 8701, can be placed in specified locations (e.g., on or nearby asubstrate, such, or end effector) to provide feedback to assist inmaintaining a substrate or a region nearby a substrate within aspecified range of temperatures. In an example, as discussed below, thetemperature monitor can be a non-contact sensor, such as an infraredtemperature monitor configured to provide information indicative of asurface temperature sampled by the sensor. Other configurations arepossible, such as can include placing the heat exchanger within ornearby a return air duct in a lower portion of the chamber as shownillustratively in FIG. 13B.

FIG. 12 illustrates generally a portion of a system such as including afurther example of a transfer module, that can be included as a portionof a coating system or can be used to manipulate a substrate before orafter processing by a coating system. As in the example of FIG. 11A, thetransfer module 1400B can include one or more fan filter units (FFUs),such as 1500A through 1500N (e.g., 14 FFUs). By contrast with thehandler 1410A of the transfer module 1400A of FIG. 11A, a handler withinthe transfer module 1400B can include a track configuration, such as toprovide linear translation of the handler along an axis. A broad rangeof other chambers or modules can be coupled to the transfer module1400B, such as in a clustered configuration, without requiring that eachother module or chamber be coupled in a manner radiating out from asingle point. One or more ducts can be located in portions of thetransfer module 1400B in a region outside a range of motion of thehandler. For example, such locations can be used to provide return ductsto bring a gas (e.g., nitrogen) from a lower portion of the transfermodule 1400B upwards to a plenum above the FFU array.

FIG. 13A and FIG. 13B illustrate generally views of a portion of asystem, such as can include a stacked configuration of substrate 4000areas that can be used in processing or holding a substrate. A port ofthe processing module 1200 can include one or more doors or hatches,such as a door 3301. For example, such doors can be mechanically orelectrically interlocked so that a door accessible to an exterior of afabrication system is unable to be opened unless a corresponding doorelsewhere on or within the system is closed. For example, the door 3301can be used to perform maintenance, while the processing module 1200 isotherwise isolated from an inert environment, or a particulate orcontaminant-controlled environment in other enclosed portions of afabrication system.

As mentioned above, a particulate or contaminant-controlled environmentcan be maintained at least in part using one or more FFUs 1500. In theexample of FIG. 13B, a cross-flow configuration is used, such as tomaintain a substantially laminar flow of gas (e.g., a non-reactive gas)across each of one or more cells 3350 that can include a substrate. Aheat exchanger 1502 can, but need not be located nearby or as a portionof the FFU 1500. For example, the heat exchanger 1502 can be locatedbelow a substrate handling area, such as included within or as a portionof a return duct 5201. A temperature can be controlled by a temperaturecontroller 8700, such as coupled to a temperature sensor 8701. Thecurved profile of portions of the duct 5201 can be specified at least inpart using a computational fluid dynamics technique, such as to maintainspecified flow characteristics (e.g., laminar flow) within theprocessing module 1200.

In addition to queuing substrates (or instead of queuing substrates),such as until another portion of the system is ready to receive suchsubstrates, the processing module 1200 can functionally participate inthe substrate fabrication process, for example by providing dryingfunctions, or by holding the substrate for a specified duration (oruntil specified criteria are met) so as to allow the substrate to evolvefrom one condition to another. In the case of holding for the purpose ofevolving the substrate, for example, the substrate can be held so as toallow for a liquid to settle or flow. A temperature of the substrateduring such evolution can be controlled through the controlledapplication of temperature controlled gas flow across the substratesurface, such as laminar flow, which can be provided to flow across theplane of the substrate, as indicated in FIG. 13B.

In general, the holding module temperature need not be the same as thetemperature of the environment in or surrounding other portions of thesystem. In another example, the substrate can rest on a cushion oftemperature-controlled gas (similar to other examples described herein,such as where the substrate is supported using a floating cushion of gasfor one or more of printing, holding, or other operations, such as atreatment operation including one or more of radiative baking or drying,convective baking or drying, or exposing the substrate to light such asto induce a chemical reaction, and combinations thereof.

In the case of drying a substrate in a processing module 1200, thecontrolled environment can provide for continuous removal of evaporatedvapors via a vapor trap or gas recirculation and purification system,and the dying process can be further controlled through the controlledapplication of gas flow across the substrate surface, such as laminarflow, which can be provided to flow across the plane of the substrate,as indicated in FIG. 13B.

VARIOUS NOTES & EXAMPLES

Example 1 can include or use subject matter (such as an apparatus, amethod, a means for performing acts, or a device readable mediumincluding instructions that, when performed by the device, can cause thedevice to perform acts), such as can include a method of providing acoating on a substrate, the method comprising transferring a substrateto a coating system configured to provide a solid layer in a specifiedregion on a first side of the substrate, the solid layer coating atleast a portion of the substrate, supporting the substrate in thecoating system using a gas cushion provided to a second side of thesubstrate opposite the specified region, printing a liquid coating overthe specified region of the substrate with the substrate located in aprinting zone using a printing system while the substrate is supportedby the gas cushion, conveying the substrate to a treatment zoneincluding continuing to support the substrate using the gas cushion, andtreating the liquid coating in the coating system to provide the solidlayer upon the substrate in the specified region including continuing tosupport the substrate using the gas cushion.

Example 2 can include, or can optionally be combined with the subjectmatter of Example 1, to optionally include that the solid layercomprises at least a portion of an encapsulation structure, and that thesubstrate comprises electronic devices, the encapsulation structureestablished to encapsulate at least a portion of the electronic deviceson the substrate.

Example 3 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 or 2 to optionallyinclude that treating the liquid coating includes polymerizing theliquid coating.

Example 4 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 through 3 to optionallyinclude holding the substrate for a specified duration after theprinting the liquid coating including continuing to support thesubstrate using the gas cushion.

Example 5 can include, or can optionally be combined with the subjectmatter of Example 4, to optionally include conveying the substrate to aholding zone for the holding the substrate for the specified duration.

Example 6 can include, or can optionally be combined with the subjectmatter of Example 5, to optionally include using a holding zoneconfigured to hold and support multiple substrates using the gascushion.

Example 7 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 or 6 to optionallyinclude that the treating the liquid coating includes irradiating theliquid coating with light.

Example 8 can include, or can optionally be combined with the subjectmatter of Example 7 to optionally include that the light includesultraviolet (UV) light.

Example 9 can include, or can optionally be combined with the subjectmatter of Example 7 to optionally include that the irradiating theliquid coating with light includes radiatively baking the liquidcoating.

Example 10 can include, or can optionally be combined with the subjectmatter of Example 7 to optionally include that the irradiating theliquid coating with light includes radiatively drying the liquidcoating.

Example 11 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 through 10 to optionallyinclude that the treating the liquid coating includes one or more ofexposing the substrate to infra-red radiation or temperature-controlledgas flow.

Example 12 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 through 11 to optionallyinclude that the specified region on the first side of the substrateoverlaps with an active region of the substrate comprising an electronicdevice, and wherein the gas cushion is provided to the second side ofthe substrate opposite the active region.

Example 13 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 through 12 to optionallyinclude that the conveying the substrate includes engaging or grippingthe substrate using physical contact with the substrate.

Example 14 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 through 13 to optionallyinclude that the gas cushion is established by forcing gas through aporous ceramic material to support the second side of the substrateabove the porous ceramic material.

Example 15 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 through 14 to optionallyinclude that the gas cushion in the printing zone is established using acombination of a pressurized gas region and at least a partial vacuum.

Example 16 can include, or can optionally be combined with the subjectmatter of Example 15, to optionally include that at least one ofpressurized gas or evacuated gas used to establish the gas cushion isrecovered and recirculated.

Example 17 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 through 16 to include,subject matter (such as an apparatus, a method, a means for performingacts, or a machine readable medium including instructions that, whenperformed by the machine, that can cause the machine to perform acts),such as can include a method of providing a coating on a substrate, themethod comprising transferring a substrate to an enclosed coatingsystem, the enclosed coating system configured to provide a solid layerin a specified region on a first side of the substrate, the solid layercoating at least a portion of an electronic device fabricated upon thesubstrate, supporting the substrate in the enclosed coating system usinga gas cushion provided to a second side of the substrate opposite thespecified region, printing a liquid coating over the specified region ofthe substrate with the substrate located in a printing zone including aprinting system while the substrate is supported by the gas cushion,conveying the substrate to a treatment zone including continuing tosupport the substrate using the gas cushion, and treating the liquidcoating in the treatment zone to provide the solid layer upon thesubstrate in the specified region including continuing to support thesubstrate using the gas cushion.

Example 18 can include, or can optionally be combined with the subjectmatter of Example 17, to optionally include that the treating the liquidcoating includes one or more of baking or drying the liquid coating toprovide the solid layer.

Example 19 can include, or can optionally be combined with the subjectmatter of Example 18, to optionally include that the treating the liquidcoating includes one or more of exposing the substrate to infra-redradiation or temperature-controlled gas flow.

Example 20 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 17 through 19 to optionallyinclude that the treating the liquid coating includes solidifying theliquid coating through one or more of inducing a chemical reaction orremoving a carrier fluid included in the liquid coating.

Example 21 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 17 through 20 to optionallyinclude that the solid layer comprises at least a portion of anencapsulation structure established to encapsulate at least a portion ofthe electronic device on the substrate.

Example 22 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 17 through 21 to optionallyinclude conveying the substrate to a holding zone and holding thesubstrate for the specified duration including continuing to support thesubstrate using the gas cushion.

Example 23 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 1 through 22 to include,subject matter (such as an apparatus, a method, a means for performingacts, or a machine readable medium including instructions that, whenperformed by the machine, that can cause the machine to perform acts),such as can include a coating system for providing a solid layer on asubstrate, the system comprising a platform configured to support thesubstrate using a gas cushion and configured to convey the substratealong the platform, a printing system configured to deposit a liquidcoating in a specified region on a first side of the substrate when thesubstrate is located in a printing zone of the platform and while thesubstrate is supported by the gas cushion on a second side opposite thefirst side, a treatment system configured to treat the deposited liquidto provide a solid layer upon the substrate in the specified region whenthe substrate is located in a treatment zone of the platform and whilethe substrate is supported by the gas cushion, and that the platform isconfigured to support the substrate continuously during a printingoperation in the printing zone and during a treatment operation in thetreatment zone.

Example 24 can include, or can optionally be combined with the subjectmatter of Example 23, to optionally include that the solid layercomprises at least a portion of an encapsulation structure, and that thesubstrate comprises electronic devices, the encapsulation structureestablished to encapsulate at least a portion of the electronic deviceson the substrate.

Example 25 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 23 or 24 to optionallyinclude that the treatment system includes a source of light, the sourceconfigured to irradiate the liquid coating to provide the solid layer.

Example 26 can include, or can optionally be combined with the subjectmatter of Example 25, to optionally include that the source comprises anultraviolet (UV) source.

Example 27 can include, or can optionally be combined with the subjectmatter of Example 25, to optionally include that the source comprises aninfra-red source.

Example 28 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 23 through 25 to optionallyinclude that the treatment system is configured to one or more of bakeor dry the liquid coating to provide the solid layer.

Example 29 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 23 through 28 to optionallyinclude that the treatment system is configured to solidify the liquidcoating through one or more of inducing a chemical reaction or removinga carrier fluid included in the liquid coating.

Example 30 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 23 through 29 to optionallyinclude that the platform is configured to hold the substrate for aspecified duration after the printing operation and before the treatmentoperation including continuing to support the substrate using the gascushion.

Example 31 can include, or can optionally be combined with the subjectmatter of Example 30, to optionally include that the platform includes aholding zone separate from the printing zone and the treatment zone, theholding zone configured to hold the substrate for the specified durationincluding continuing to support the substrate using the gas cushion.

Example 32 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 23 through 30 to optionallyinclude an enclosure housing the printing system, the treatment system,and the platform including a controlled processing environment at ornear atmospheric pressure and established to remain below specifiedlimits of particulate contamination level, water vapor content, oxygencontent, and ozone content.

Example 33 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 23 through 32 to optionallyinclude that the specified region on the first side of the substrateoverlaps with an active region of the substrate comprising an electronicdevice, and wherein platform is configured to provide the gas to thesecond side of the substrate opposite the active region.

Example 34 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 23 through 33 to optionallyinclude that the platform is configured to convey the substrateincluding engaging or gripping the substrate using physical contact withthe substrate.

Example 35 can include, or can optionally be combined with the subjectmatter of one or any combination of Examples 23 through 34 to optionallyinclude that the gas cushion is established by forcing gas through aporous ceramic material to support the second side of the substrateabove the porous ceramic material.

Each of the non-limiting examples described herein can stand on its own,or can be combined in various permutations or combinations with one ormore of the other examples.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which theinvention can be practiced. These embodiments are also referred toherein as “examples.” Such examples can include elements in addition tothose shown or described. However, the present inventors alsocontemplate examples in which only those elements shown or described areprovided. Moreover, the present inventors also contemplate examplesusing any combination or permutation of those elements shown ordescribed (or one or more aspects thereof), either with respect to aparticular example (or one or more aspects thereof), or with respect toother examples (or one or more aspects thereof) shown or describedherein.

In the event of inconsistent usages between this document and anydocuments so incorporated by reference, the usage in this documentcontrols.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

Method examples described herein can be machine or computer-implementedat least in part. Some examples can include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure an electronic device to perform methods as described in theabove examples. An implementation of such methods can include code, suchas microcode, assembly language code, a higher-level language code, orthe like. Such code can include computer readable instructions forperforming various methods. The code may form portions of computerprogram products. Further, in an example, the code can be tangiblystored on one or more volatile, non-transitory, or non-volatile tangiblecomputer-readable media, such as during execution or at other times.Examples of these tangible computer-readable media can include, but arenot limited to, hard disks, removable magnetic disks, removable opticaldisks (e.g., compact disks and digital video disks), magnetic cassettes,memory cards or sticks, random access memories (RAMs), read onlymemories (ROMs), and the like.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features may be grouped together to streamline the disclosure.This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription as examples or embodiments, with each claim standing on itsown as a separate embodiment, and it is contemplated that suchembodiments can be combined with each other in various combinations orpermutations. The scope of the invention should be determined withreference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

What is claimed is:
 1. A method of forming a material layer on asubstrate, the method comprising: loading a substrate into a printingzone of a coating system using a substrate handler; printing an organicink material on a substrate while the substrate is located in theprinting zone; transferring the substrate from the printing zone to atreatment zone of the coating system; treating the organic ink materialdeposited on the substrate in the treatment zone to form a film layer onthe substrate; and removing the substrate from the treatment zone usingthe substrate handler.
 2. The method of claim 1, wherein the removing ofthe substrate comprises grasping or clamping the substrate via thesubstrate handler.
 3. The method of claim 1, wherein the removing of thesubstrate comprises applying a vacuum force to the substrate via thesubstrate handler.
 4. The method of claim 1, wherein the removing of thesubstrate using the substrate handler comprises moving the substratehandler along a track.
 5. The method of claim 1, wherein the removing ofthe substrate using the substrate handler comprises moving an endeffector of the substrate handler in one or more degrees of freedomrelative to an arm of the substrate handler.
 6. The method of claim 1,further comprising after removing the substrate from the treatment zone,loading the substrate into a second coating system using the substratehandler, the second coating system comprising a second printing zone anda second treatment zone.
 7. The method of claim 6, further comprising:printing a second organic ink material on the substrate while thesubstrate is located in the second printing zone; and treating thesecond organic ink material deposited on the substrate in the secondtreatment zone to form a second film layer on the substrate, the filmlayer being a first film layer that differs from the second film layer.8. The method of claim 1, wherein the substrate handler is locatedwithin a transfer module, the method further comprising holding thesubstrate in the transfer module at least one of before and afterprinting the organic ink material on the substrate.
 9. The method ofclaim 8, further comprising controlling a temperature of the transfermodule while the substrate is held in the transfer module.
 10. Themethod of claim 8, further comprising maintaining a level of one or morereactive species within the transfer module to be about 100 ppm orlower.
 11. The method of claim 1, further comprising, after treating theorganic ink material in the treatment zone: loading the substrate into atransfer module, the substrate handler located within the transfermodule, and removing the substrate from the transfer module using asecond substrate handler.
 12. The method of claim 1, further comprisingsupporting the substrate with a gas cushion during each of the printing,transferring, and treating steps.
 13. The method of claim 12, whereinthe organic ink material is deposited on a first side of the substrateand the gas cushion is provided to a second side of the substrate, thefirst side being opposite of the second side.
 14. The method of claim 1,wherein the film layer comprises at least a portion of an encapsulationstructure, and the organic ink material is printed over an electronicdevice on the substrate.
 15. The method of claim 1, wherein treating theorganic ink material in the treatment zone comprises exposing theorganic ink material to an ultraviolet (UV) light.
 16. The method ofclaim 1, wherein treating the organic ink material in the treatment zonecomprises at least one of drying, baking, and chemically reacting theorganic ink material.
 17. The method of claim 1, further comprisingholding the substrate in a holding zone at least one of before and afterprinting the organic ink material on the substrate.
 18. The method ofclaim 17, further comprising moving the substrate in a U-shaped routewhen transferring the substrate between the printing zone, the holdingzone, and the treatment zone.
 19. The method of claim 17, wherein theholding zone comprises a plurality of holding regions in a stackedarrangement, the method further comprising moving a first holding regionof the plurality of holding regions to selectively align the firstholding region in a same plane with the printing zone.
 20. The method ofclaim 1, wherein the holding zone comprises a plurality of holdingregions on a rotatable platform, the method further comprising rotatingthe platform to selectively align a first holding region of theplurality of holding regions with the printing zone.